System in Package (SiP) DSMBGA Antenna in Package (AiP)

Create highly integrated products with a smaller package and increased functionality

Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.

Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.

Amkor Technology defines advanced SiPs as multi-component, multifunction products in an IC package. They require high-precision assembly technologies, which leverage Amkor’s strengths.

• Size reduction
• Ultra-thin package
• Thin substrate with core and coreless using finer line and spacing
• Conformal and compartmental shielding
• Low filler size for mold underfill
• Fine pitch flip chip and copper pillar
• Double side assembly
• Test development and production test
• Turnkey solution