【学术论文】高速PCB电路电源完整性仿真分析
针对日益复杂的高速印制电路板(Printed Circuit Board,PCB)电源电压波动问题,提出一种基于电源分配网络(Power Distribution Network,PDN)与目标阻抗协同仿真设计的方法,对1.15 V电源网络的电源完整性(Power Integrity,PI)进行研究。主要涉及两个方面:(1)直流分析,通过加宽覆铜面积、减少回流路径等措施使1.15 V电压降从9 mV跌落至2.5 mV、温度从1.3 ℃降至0.1 ℃、直流电流密度从91.340 3 A/mm2降至82.393 5 A/mm2;(2)交流分析,从谐振分布和PDN输入阻抗分析,在987.34 MHz谐振点处添加22 μF去耦电容,搭建去耦网络去除风险点。仿真结果表明该方法有效地减少了高速PCB电路潜在的电压波动和目标阻抗不匹配的风险,从而提高了电源系统稳定性和可靠性。
中文引用格式: 孟祥胜,车凯,栗晓锋,等. 高速PCB电路电源完整性仿真分析[J].电子技术应用,2019,45(9):50-52,59.
英文引用格式: Meng Xiangsheng,Che Kai,Li Xiaofeng,et al. High-speed PCB circuit power integrity simulation analysis[J]. Application of Electronic Technique,2019,45(9):50-52,59.
0 引言
1 电源完整性分析
1.1 PDN的设计与目标阻抗
1.2 PI设计优化流程
2 仿真结果分析
2.1 IMX53板卡介绍
2.2 直流分析
电流密度的计算公式如式(2)所示:
2.3 交流分析
2.3.1 谐振分布仿真分析
2.3.2 谐振分布仿真分析
3 结论
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作者信息:
孟祥胜,车 凯,栗晓锋,李玖法,李苏炫,何雪琴
(湖北汽车工业学院 电气与信息工程学院,湖北 十堰442002)