ON Semiconductor: System

System-in-Package (SiP)

System-in-Package options from ON Semiconductor enable greater system integration using advanced 3D packaging technology. Diverse technologies may be integrated
at the package level, leading to a reduced footprint. Using existing die products reduces development time, thereby allowing full-custom or semi-custom products to go to
market quicker

Typical SiP Die Components

• Custom Analog Front End (AFE) ASIC incorporating existing analog and power management IP blocks, as well as custom designs
• Platform MCU based on ARM Cortex M0+/M3
• Power MOSFETs for drivers, power regulation, or load switching
• MEMs or 3rd party sensor
• Additional Memory: SRAM, EEPROM, Flash, etc.

SiP Options

• Wirebonded in stacked or side-by-side configuration
• Thru-silicon vias (TSVs)
• Capability for three or more die in one package

Struix SiP Example

Reasons for Using a Mixed Signal ASIC for Industrial Applications

Reasons for Using a Mixed Signal ASIC for Medical Imaging