System In Package (SiP) | Teledyne e2v Semiconductors
System in Package (SIP)
A System in Package integrates a number of ICs into a highly compact package that functions as a unit. There is a huge trend in microelectronics towards System in Package, heterogeneous integration. HiRel / Space is highly concerned, as low and medium volumes prohibit the development of System on Chip (SoC).
SiP is a concept, not a package type or a technology with infinite potential configurations!
Teledyne e2v brings its knowledge and heritage in producing components and systems for high-end markets to meet customers’ expectations for highly integrated devices.
If you wish to learn more about our SiP capabilities, please download our latest white paper:
Making History: Advanced System in a Package Technologies Enable Direct RF Conversion
Strengths of SiP:
- Heterogeneous integration, ie. the use of dies from different technologies and / or manufacturer, which permits the selection of the optimum technology for each function
- Quick development through parallel development of each function
- Product versatility, because a new product can easily be developed by changing one function, without total re-development
- Much better SWaP (Size, Weight and Power) factor than solutions built from discrete devices
- Faster time to market
- Better economical fit with market nature (low volume)
SiP Capabilities at Teledyne e2v:
- Electronics design
- Package design
- Test engineering
- Thermal and signal, integrity simulations
- Manufacturing
- Life cycle management / long term support
MCM Heritage at Teledyne e2v
Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.